Equipment: Die Sorter
Maker: Laurier
Model: DS9000
Equipment: Flip Chip Bonder
Maker: Shinkawa
Model: SFB-200
Equipment: Flip Chip Bonder
Maker: Panasonic
Model: FCB3
Equipment: Flip Chip Bonder
Maker: DATACON
Model: 2200 apm+
Equipment: Flip Chip Bonder
Maker: DATACON
Model: 2200 EVO
Equipment: Flip Chip Bonder
Maker: DATACON
Model: 8800 FC QUANTUM
Equipment: DIE BONDER
Maker: ESEC
Model: 2008xP
Equipment: DIE BONDER
Maker: ESEC
Model: 2008hS3 plus
Equipment: DIE BONDER
Maker: Shinkawa
Model: SPA300SUPER
Equipment: DIE BONDER
Maker: Renesas
Model: CM-700
Equipment: DIE BONDER
Maker: Renesas
Model: CM700H
Equipment: DIE BONDER
Maker: RENESAS
Model: DB700
Equipment: CHIP ON WAFER BONDER
Maker: TORAY
Model: FC-5000WL
PRODUCT
Equipment: Die Sorter
Maker: Laurier
Model: DS9000
Equipment: Flip Chip Bonder
Maker: Shinkawa
Model: SFB-200
Equipment: Flip Chip Bonder
Maker: Panasonic
Model: FCB3
Equipment: Flip Chip Bonder
Maker: DATACON
Model: 2200 apm+
Equipment: Flip Chip Bonder
Maker: DATACON
Model: 2200 EVO
Equipment: Flip Chip Bonder
Maker: DATACON
Model: 8800 FC QUANTUM
Equipment: DIE BONDER
Maker: ESEC
Model: 2008xP
Equipment: DIE BONDER
Maker: ESEC
Model: 2008hS3 plus
Equipment: DIE BONDER
Maker: Shinkawa
Model: SPA300SUPER
Equipment: DIE BONDER
Maker: Renesas
Model: CM-700
Equipment: DIE BONDER
Maker: Renesas
Model: CM700H
Equipment: DIE BONDER
Maker: RENESAS
Model: DB700
Equipment: CHIP ON WAFER BONDER
Maker: TORAY
Model: FC-5000WL
ASE Semiconductor
地址. 韩国首尔市瑞草区江南大道309号韩国商业中心B/D座410室
邮箱. info@asesemiconductor.com
电话. +82-2-582-6900
传真. +82-2-582-6903
